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[Case Study] Copper Core Ball Installation Work

By using a copper core ball, deformation of the ball is minimized, enabling 3D implementation and narrow pitch implementation.

Compared to solder balls: ◎ Excellent strength, allowing for clearance in semiconductor packages ◎ Suppresses deformation of the balls, secures space, and enables the realization of a highly reliable component structure ◎ Allows for narrow pitch mounting similar to Cu pillars ◎ Enables high heat dissipation and measures against electromigration